HIGH-QUALITY Ni-Fe/Cu MULTILAYER FILMS
                                                                      WITH ANTIFERROMAGNETIC COUPLING 

                                                                       F. Stobiecki, J. Dubowik, T. Lucinski, B. Szymanski,

                                                                     Institute of Molecular Physics, Polish Academy of Sciences
                                                                           Smoluchowskiego 17, 60-179 Poznan, Poland 

                                                                                     H. Rohrmann, K. Roll

                                                                      University of Kassel, FB Physik, 34109 Kassel, Germany 

                                                                                        and M. Schmidt

                                                                 Institute of Physics, A. Mickiewicz University, 60-780 Poznan, Poland 

       We report structural and magnetic properties of Ni_{83}Fe_{17}/Cu multilayer films with various buffer layer and sublayer thicknesses of copper d_{Cu} and Permalloy d _{Py} deposited by face-to-face sputtering.
The following features prove a good quality of our films: a well-layered structure, complete antiferromagnetic coupling with a low coupling strength (2\times10^{-5} J /m^2 for d_{Cu}=1 nm and 10^{-6} J/m^2 for d_{Cu}=2.1
nm) and a low coercive field which make them attractive for possible applications as giant magnetoresistance sensors.